qmk_firmware/builddefs
Nick Brassel bebfdad795
NVRAM refactor, phase 1. (#18969)
* Rename `eeprom_stm32` to `eeprom_legacy_emulated_flash`.

* Rename `flash_stm32` to `legacy_flash_ops`.

* Rename `eeprom_teensy` to `eeprom_kinetis_flexram`.
2022-11-23 08:50:19 +00:00
..
build_full_test.mk
build_json.mk
build_keyboard.mk Generalise CTPC logic from common_features (#18803) 2022-10-22 12:39:39 -07:00
build_layout.mk
build_test.mk Fix garbled test output (#18822) 2022-10-23 04:30:17 +01:00
common_features.mk NVRAM refactor, phase 1. (#18969) 2022-11-23 08:50:19 +00:00
common_rules.mk compiler.txt: ensure file exists before comparison (#18921) 2022-11-01 00:35:38 +00:00
converters.mk Allow QK_MAKE to work with converters (#18637) 2022-10-08 09:13:58 -07:00
disable_features.mk Remove thermal printer. (#18959) 2022-11-06 00:15:55 +11:00
generic_features.mk
mcu_selection.mk Move EFL wear-leveling driver to be default for F1, F3, F4, L4, G4, WB32, GD32V. (#19020) 2022-11-11 23:57:44 +00:00
message.mk
show_options.mk Remove thermal printer. (#18959) 2022-11-06 00:15:55 +11:00
testlist.mk